Target specification 5SFG 0660B07500x
RoadPak SiC phase-leg module
• VDSS = 750 V• ID = 2 x 660 A*
• Molded package optimized for EV application
• Pin-fin structure for lowest thermal resistance
• lowest losses thanks to Silicon Carbide chipset
• main terminals with holes (screw connection) or without holes for welding
